器件名称: 6N139
功能描述: Small Outline, 5 Lead, Low Input Current, High Gain Optocouplers
文件大小: 88.66KB 共8页
简 介:Small Outline, 5 Lead, Low Input Current, High Gain Optocouplers Technical Data
HCPL-M700 HCPL-M701
Features Surface Mountable Very Small, Low Profile JEDEC Registered Package Outline Compatible with Infrared Vapor Phase Reflow and Wave Soldering Processes High Current Transfer Ratio - 2000% Low Input Current Capability - 0.5 mA TTL Compatible Output VOL = 0.1 V Guaranteed ac and dc Performance Over Temperature: 0°C to 70°C High Output Current 60 mA Recognized under the Component Program of U.L. (File No. E55361) for Dielectric Withstand Proof Test Voltage of 3750 Vac, 1 Minute Lead Free Option “-000E”
Description
These small outline, low input current, high gain optocouplers are single channel devices in a five lead miniature footprint. They are electrically equivalent to the following Agilent optocouplers:
SO-5 Package HCPL-M700 HCPL-M701
Standard DIP 6N138 6N139
SO-8 Package HCPL-0700 HCPL-0701
The SO-5 JEDEC registered (MO155) package outline does not require “through holes” in a PCB. This package occupies approximately one-fourth the footprint area of the standard dual-in-line package. The lead profile is designed to be compatible with standard surface mount processes. These high gain series optocouplers use a Light Emitting
Diode and an integrated high gain photodetector to provide extremely high current transfer ratio between input and output. Separate pins for the photodiode and output stage results in TTL compatible saturation voltages and high speed……
