器件名称: 2XP9/210
功能描述: Heatsink For capsule devices
文件大小: 628.51KB 共3页
简 介:P9
,- . !,/' . !6(' 7 ,- .!,/' !" (( 0 , 65 0 , (( 0 , 65 0 , #
)!* '1,/2 3('' *4 '1,/2 3('' *4 # $ ! % &'' (! )!* '1'&2 '1'2( '1' '1'&, + 51, /&1
Heatsink
Dimensions in mm
For capsule devices
P9
Features
.
3 % /15 +!4
Dimensions in mm
.
1
17-03-2005 ADR
by SEMIKRON
P9
Fig.5a Thermal resistance and pressure drop vs.air flow
Fig.5b Thermal resistance and pressure drop vs.air flow (per device)
Fig.1 Thermal resistance vs.dissipated power
Fig.9 Transient thermal impedance vs.time
Fig.11a Transient thermal impedance vs.time
Fig.11b Transient thermal impedance vs.time
2
17-03-2005 ADR
by SEMIKRON
P9
Dimensions in mm
/8
-
,- + .!,/'
9 :;<:
3
17-03-2005 ADR
by SEMIKRON
……
