器件名称: 2XP8.5/150
功能描述: Heatsink For capsule devices
文件大小: 309.47KB 共3页
简 介:P 8,5
*+ , -.!/.0 !" 11 2 * #
'!( 0-1 3*00 (4 # $ % & ! '!( 0-05 ) *-6
Dimensions in mm
Heatsink For capsule devices
P8,5
Features
, -.
3 % 6-. )!4
Dimensions in mm
, -.
1
28-10-2004 SCT
by SEMIKRON
P 8,5
Fig.2 Thermal resistance per component vs.length
Fig.6 Total thermal resistance vs.length
2
28-10-2004 SCT
by SEMIKRON
P 8,5
Dimensions in mm
/7 +
) , -. 8
Dimensions in mm
*7 +
)
)
3
28-10-2004 SCT
by SEMIKRON
……
