器件名称: 2XP17/60
功能描述: For capsule devices
文件大小: 1093.54KB 共4页
简 介:P 17
*+ , -.!-/0 !" -1 2 *4 2 * // 2 * -1 2 *4 2 * *4 2 * // 2 * . 2 * #
'!( 031 $-*0(& 03 $-*0(& 03. $-*0(& # $% !&
'!( 03-** $/00 /!& 03- $/00 /!& 0304 $/00 /!& 03-.4 $/00 /!& 03- $/00 /!& 03-/4 03-** 03--4 ) /
, -.!-/0 5 *+ , -.!60 78' -000 $ , -.!-/0&
*31 /
Heatsink For capsule devices
9: :*
Dimensions in mm
P 17
Features
, -.
$ ; -036 )!&
Dimensions in mm
, -.
1
17-03-2005 ADR
by SEMIKRON
P 17
Fig.1 Thermal resistance vs. dissipated power
Fig.5a Thermal resistance and pressure drop vs. air flow
Fig.5b Thermal resistance and pressure drop vs. air flow
Fig.9a Transient thermal impedance vs.time
Fig.9b Transient thermal impedance vs.time
2
17-03-2005 ADR
by SEMIKRON
P 17
Fig.11a Transient thermal impedance vs.time
Fig.11b Transient thermal impedance vs.time
Fig.11c Transient thermal impedance vs.time
Fig.11d Transient thermal impedance vs.time
Fig.11e Transient thermal impedance vs.time
Fig.11f Transient thermal impedance vs.time
3
17-03-2005 ADR
by SEMIKRON
P 17
Dimensions in mm
-:
+
) , -.!-/0 5 *+ , -.!60 *
Dimensions in mm
*: +
,-.!-/0
$) -000&
4
17-03-2005 ADR
by SEMIKRON
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