器件名称: 2XP11/260
功能描述: For capsule devices
文件大小: 520.85KB 共3页
简 介:P 11
'( ) **!'+, '( ) **!',, 4 ) **!*+ !" #
$!% ,-*.+ /0,, %1 ,-'20 /*2+ %1 ,-'+0 /0,, %1 ,-'05 /0, %1 #
$!% & 2-+ *'-'
,-,.' /
$3 .'0,,*1
Heatsink For capsule devices
P 11
Dimensions in mm
Features
) **
/ 6 *+ &!1
Dimensions in mm
) **
1
06-10-2005 ADR
by SEMIKRON
P 11
Fig.2 Thermal resistance per component vs.length
Fig.6 Transient thermal resistance vs.length
Fig.11 Transient thermal impedance vs.time
2
06-10-2005 ADR
by SEMIKRON
P 11
Dimensions in mm
*7 (
& ) **
Dimensions in mm
'7 (
& )** 8
3
06-10-2005 ADR
by SEMIKRON
……
