器件名称: R&S® 紧凑型TSVP 测试系统全能型平台
功能描述: R&S®紧凑型TSVP 是专门为高性能 ATE 应用领域开发的全套产品，其机箱中包括一个机架、数字背板、模拟背板、电源开关和过滤器、电源、诊断扩展装置。R&S®紧凑型TSVP 分为一个测试与测量平台和一个开关应用平台。
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简 介:Version 01.01
CompactTSVP Test and Measurement Chassis TS-PCA3
Open test platform based on CompactPCI and PXI
Modular instrument chassis for CompactPCI and PXI modules Standard 19” rack-mount 4HU enclosure for 3HU CompactPCI CompactPCI backplane conforming to PICMG 2.0 Rev. 3.0 specification Rear I/O support for easy system cabling (IEEE 1101.11-1998) Sophisticated analog measurement bus subsystem Support of PXI trigger concept 14 peripheral slots for versatile instrumentation Seamless test adaptation by using standardized adapter components Simple and efficient module connection concept Easily expandable ATE switching High pincount switching expansion by cascading an PowerTSVP chassis Cost-effective peripheral control via CAN Rohde & Schwarz’s overall commitment to industrial standards
February 2007
Product introduction
The CompactTSVP concept represents true innovation in state-ofthe-art PC-based instrumentation while offering traditional capabilities found in high-performance ATE systems. The versatile platform accelerates the adoption of CompactPCI and PXI in all major fields of industrial test-andmeasurement applications. With its large number of CompactPCI/ PXI slots and the tight integration of ATE functionality provided by Rohde&Schwarz instrumentation and switching modules, the CompactTSVP is the ideal platform for highly productive system engineering. Compact units are used to configure complex ATE functionality which can be interfaced to DUTs by th……
