器件名称: 605SJR00200E-T
功能描述: Surface Mount Metal Plate Current Sense
文件大小: 176.88KB 共2页
简 介:FEATURES
Superior thermal expansion cycling Inductance less than 10 nanohenries Flameproof Solderable pads: Tin (Sn) plate Lead flexible for thermal expansion Low termination stress (“J” terminals) Shape provides cooler operation Custom values available
APPLICATIONS
Current sensing Low inductance AC applications (contact Ohmite) Feedback
602SJR, 605SJR
W
Surface Mount Metal Plate Current Sense
610SJR
W
60S Series
L
H
L2
DERATING
100 80 Percent Rated Power 60 Area of recommended operation 40 20 0 -40
L
L2
D
Copper Nickel Alloy Termination
H
A
0
50 70 100 155 200 Ambient Temperature, °C
250 275
PERFORMANCE CHARACTERISTICS
Parameter Resistance T.C.R. Requirement Within regulated tolerance Within specified T.C.R. Test Method (JIS C 5202) 25°C
Power Resistance Rated TCR Rating Values Ambient Type Tol. (ppm/C°) (watts) (Ω) Temp. (°C) 602SJR ±5% ±100 0.25 0.003, 0.005 +70°C 605SJR ±5% ±100 0.5 0.002, 0.0375, +70°C 0.005, 0.008 610SJR ±5% ±350 1 0.002, 0.003 +85°C
Operating Temp. Range (°C) -40 - +155 -40 - +155 -40 - +155
Qty./ Reel 2000 2000 1500
DIMENSIONS
L 602SJR
inches (mm) L2 0.018 ± .008 (2 ± 0.2) 0.018 ± .008 (2 ± 0.2) D 0.095 ± .010 (2.35 ± 0.25) H 0.024 (0.6 ± 0.1) 0.079 (2 max.) A 0.189 ± .030 (4.8 ± .75) W 0.118 ± .008 (3.0 ± 0.2) 0.20 ± .008 (5.2 ± 0.2) W 0.126 ± .016 (3.2 ± 0.40)
Room temperature/100°C up 350°C ± 10°C, 3 seconds
0.39 ± .008 (10.0 ± 0.2) 0.39 ± .008 (10.0 ± 0.2) L H
Resistance to Solder ±2.0% Heat Solderability Moisture ……
