EEPW首页 | 器件索引 | 厂商列表 | IC替换 | 微缩略语 | 电路图查询
器件查询:
400万器件资料库等您来搜!
   首页 > WEDC > W3E16M72S-200BC

W3E16M72S-200BC

器件名称: W3E16M72S-200BC
功能描述: 16Mx72 DDR SDRAM
文件大小: 840.72KB    共17页
生产厂商: WEDC
下  载:    在线浏览   点击下载
简  介:White Electronic Designs 16Mx72 DDR SDRAM FEATURES DDR SDRAM Rate = 200, 250, 266 Package: 219 Plastic Ball Grid Array (PBGA), 32 x 25mm 2.5V ±0.2V core power supply 2.5V I/O (SSTL_2 compatible) Differential clock inputs (CLK and CLK#) Commands entered on each positive CLK edge Internal pipelined double-data-rate (DDR) architecture; two data accesses per clock cycle Programmable Burst length: 2,4 or 8 Bidirectional data strobe (DQS) transmitted/received with data, i.e., source-synchronous data capture (one per byte) DQS edge-aligned with data for READs; centeraligned with data for WRITEs DLL to align DQ and DQS transitions with CLK Four internal banks for concurrent operation Two data mask (DM) pins for masking write data Programmable IOL/IOH option Auto precharge option Auto Refresh and Self Refresh Modes Commercial, Industrial and Military Temperature Ranges Organized as 16M x 72 Weight: W3E16M72S-XBX – 3.55 grams typical * This product is subject to change without notice.. W3E16M72S-XBX BENEFITS 40% SPACE SAVINGS Reduced part count Reduced I/O count 34% I/O Reduction Reduced trace lengths for lower parasitic capacitance Suitable for hi-reliability applications Laminate interposer for optimum TCE match Upgradeable to 32M x 72 density (W3E32M72S-XBX) GENERAL DESCRIPTION The 128MByte (1Gb) DDR SDRAM is a high-speed CMOS, dynamic random-access, memory using 5 chips containing 268,435,456 bits. Each chip is internally congured as a quad-bank DRAM. Each of the chip’s 67,108……
相关电子器件
器件名 功能描述 生产厂商
W3E16M72S-200BC 16Mx72 DDR SDRAM WEDC
《电子产品世界》杂志社 版权所有 北京东晓国际技术信息咨询有限公司
Copyright ©2002 ELECTRONIC ENGINEERING & PRODUCT WORLD. All rights reserved.
京ICP备12027778号-2