器件名称: W332M72V-100SBI
功能描述: 32Mx72 Synchronous DRAM
文件大小: 473.16KB 共15页
简 介:White Electronic Designs
32Mx72 Synchronous DRAM
FEATURES
High Frequency = 100, 125, 133MHz Package: 208 Plastic Ball Grid Array (PBGA), 16 x 22mm 3.3V ±0.3V power supply for core and I/Os Fully Synchronous; all signals registered on positive edge of system clock cycle Internal pipelined operation; column address can be changed every clock cycle Internal banks for hiding row access/precharge Programmable Burst length 1,2,4,8 or full page 8192 refresh cycles Commercial, Industrial and Military Temperature Ranges Organized as 32M x 72 Weight: W332M72V-XSBX - 2.0 grams typical
W332M72V-XSBX
GENERAL DESCRIPTION
The 256MByte (2Gb) SDRAM is a high-speed CMOS, dynamic random-access, memory using 5 chips containing 536,870,912 bits. Each chip is internally congured as a quad-bank DRAM with a synchronous interface. Each of the chip’s 134,217,728-bit banks is organized as 8,192 rows by 1,024 columns by 16 bits. Read and write accesses to the SDRAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, which is then followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0, BA1 select the bank; A012 select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access……
