器件名称: SB1316
功能描述: Chip LED Lamp
文件大小: 79.8KB 共3页
简 介:Semiconductor
SB1316
Chip LED Lamp
Features
1.6mm(L)×0.8mm small size surface mount type Thin package of 0.55mm(H) thickness Transparent clear lens optic Low power consumption type chip LED
Applications
LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp
Outline Dimensions
unit : mm
1
SB1316
Absolute maximum ratings
Characteristic
Power Dissipation Forward Current * Peak Forward Current Reverse Voltage Operating Temperature Storage Temperature * Soldering Temperature
2 1
Symbol
PD IF IFP VR Topr Tstg Tsol
Ratings
40 10 50 4 -25 -30 240 80 100 for 5 seconds
Unit
mW mA mA V
*1.Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended soldering Temperature Profile 2-1) Preheating 100 to 150 within 2 minutes Soldering 240 Gradual cooling (Avoid quenching)
within 5 seconds
Electrical Characteristics
Characteristic
Forward Voltage Luminous Intensity Peak Wavelength Spectrum Bandwidth Reverse Current Half Angle
R
Symbol
VF IV
Test Condition
IF= 10mA IF= 10mA IF= 10mA IF= 10mA VR=4V IF= 10mA
Min
-
Typ
4.0 3 430 35 ±65 ±70
Max
10 -
Unit
V mcd nm nm uA deg
λP
θ
2
SB1316
Characteristic Diagrams
Fig. 1 IF - VF Fig. 2 IV - IF
Forward Current IF [mA]
Forward Voltage VF [V]
Luminous Intensity Iv [mcd]
Forward Current IF [mA]
Fig. 3 IF – Ta
Fig.4 Spectrum Distribution
Forward Current IF [mA]
Relative Intensity [%]
Ambient Temperature Ta [
]
Wavelength λ [nm]
Fig. 5-1 Radiation Diagram(X)
Fig. 5-2 Radiation Diagram(Y)……
