器件名称: SB1314E-V
功能描述: Chip LED
文件大小: 243.91KB 共5页
简 介:Semiconductor
SB1314E-V
Chip LED
Features
1.6mm(L)×0.8mm small size surface mount type Thin package of 0.4mm(H) thickness Transparent clear lens optic Low power consumption type chip LED Emitting Light Blue(470nm)
E ; ESD Protected (±2.0KV, 3 Times @100pF, 1.5K)
Applications
LCD backlighting Keypad backlighting Symbol backlighting Front panel indicator lamp
Outline Dimensions
unit : mm
KSD-O8F001-001
1
SB1314E-V
Absolute Maximum Ratings
Characteristic
Power dissipation Forward current * Peak forward current Operating temperature range Storage temperature range
2 1
(Ta=25oC)
Symbol
PD IF IFP Topr Tstg
Rating
70 20 50 -2580 -30100
Unit
mW mA mA ℃ ℃
* Soldering temperature Tsol 240℃ for 10 seconds *1. Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended reflow soldering temperature profile - Preheating 150℃ to 185℃ within 120 seconds soldering 240℃ within 10 seconds Gradual cooling (Avoid quenching) Temp (℃) 240 Peak Temp max. 240℃ Preheating area 150~185℃, 90±30sec 185 150 max. 3℃/sec max. 4℃/sec Time from 25℃ to Peak Temperature max. 6min 0 60 150 180 240 Time (sec) max. -6℃/sec max. 10sec
Solder area 220℃, max. 60sec
25
Electrical / Optical Characteristics
Characteristic
Forward voltage
(Ta=25oC)
Symbol
VF IV
Test Condition
IF= 5mA IF= 5mA IF= 5mA IF= 5mA
Min
2.6 5 460 -
Typ
35 ±65 ±70
Max
3.3 40 485 -
Unit
V mcd nm nm deg
*3Luminous intensity *5Peak wavelength
Spectrum bandwidth
λP λ
θ1/2 X Y
*4Half angle
IF= 5mA
KSD-O8F001-001
2
……
