器件名称: MBD330DWT1
功能描述: Dual SCHOTTKY Barrier Diodes
文件大小: 546.71KB 共5页
简 介:Dual SCHOTTKY Barrier Diodes
Application circuit designs are moving toward the consolidation of device count and into smaller packages. The new SOT–363 package is a solution which simplifies circuit design, reduces device count, and reduces board space by putting two discrete devices in one small six– leaded package. The SOT–363 is ideal for low–power surface mount applications where board space is at a premium, such as portable products.
Surface Mount Comparisons:
Area (mm 2 ) Max Package P D (mW) Device Count SOT–363 4.6 120 2 SOT–23 7.6 225 1
1 2 3
MBD110DWT1 MBD330DWT1 MBD770DWT1
6 5 4
SOT–363 CASE 419B–01, STYLE 6
Space Savings:
Package SOT–363 1 × SOT–23 40% 2 × SOT–23 70% Cathode 6 N/C 5 Anode 4
The MBD110DW, MBD330DW, and MBD770DW devices are spin–offs of our popular MMBD101LT1, MMBD301LT1, and MMBD701LT1 SOT–23 devices. They are designed for high–efficiency UHF and VHF detector applications. Readily available to many other fast switching RF and digital applications. Extremely Low Minority Carrier Lifetime Very Low Capacitance Low Reverse Leakage
1 Anode
2 N/C
3 Cathode
MAXIMUM RATINGS
Rating Reverse Voltage MBD110DWT1 MBD330DWT1 MBD770DWT1 Forward Power Dissipation T A = 25°C Junction Temperature Storage Temperature Range PF TJ T stg Symbol VR Value 7.0 30 70 120 –55 to +125 –55 to +150 Unit Vdc
mW °C °C
DEVICE MARKING
MBD110DWT1 = M4 MBD330DWT1 = T4 MBD770DWT1 = H5 Thermal Clad is a trademark of the Bergquist Company.
MBD110–1/5
MBD110DWT1 MBD330DWT1……
